Designed for high-power electronic devices, this copper heatsink maximizes thermal conductivity. Copper is notoriously difficult to machine due to its ductility ("gumminess"), but it offers superior heat dissipation compared to aluminum. This product showcases our ability to handle challenging materials for functional applications.
We use sharp, polished carbide tools and specific cutting strategies to prevent the soft copper from sticking to the cutter (built-up edge).
The tall, thin cooling fins are machined with high aspect ratios. We carefully control feed rates to prevent the fins from bending during the cutting process.
The base contact area is fly-cut to achieve extreme flatness and a mirror-like finish, ensuring maximum thermal transfer efficiency with the CPU or heat source.
Copper (approx. 400 W/m·K) transfers heat almost twice as fast as Aluminum.
CNC machining allows for custom fin shapes and mounting holes that extrusion cannot achieve.
Can be treated with anti-oxidation coating or nickel plating to prevent tarnishing over time.
Ideal for lasers, 5G base stations, and high-performance computing (HPC) cooling.
A1: CNC allows for prototypes, low volumes, and complex 3D shapes (like pin fins) that extrusion cannot produce.
A: We can suggest hybrid designs (Copper base + Aluminum fins) or optimize the design to reduce machining time.
A3: We vacuum pack parts immediately after cleaning and can apply clear passivation or plating.
Don't let tolerance stack-up delay your product launch. Submit your project details, and our engineering team will evaluate your design for manufacturability before the first cut.
Copper and aluminum are the two most common materials. Copper offers approximately twice the thermal conductivity of aluminum (~400 W/m·K vs. ~200 W/m·K), making it ideal for high-power applications. Aluminum is lighter and more cost-effective for general-purpose cooling.
We support prototype quantities starting from a single piece, all the way up to high-volume production runs. There is no strict MOQ — we tailor our production planning to your specific project requirements and budget.
We offer several surface treatment options including electroless nickel plating, clear passivation, tin plating, and polishing. These treatments protect against oxidation, improve solderability, and enhance the appearance of the finished part.
Using fly-cutting techniques, we can achieve flatness tolerances within ±0.005 mm on the base contact surface. This mirror-like finish ensures maximum thermal contact and minimizes thermal interface resistance between the heatsink and the heat source.
Yes. Hybrid heatsink designs — combining a copper base for rapid heat absorption with aluminum fins for lightweight heat dissipation — are a cost-effective solution we commonly produce. This approach reduces material cost while maintaining excellent thermal performance.
CNC copper heatsinks are widely used in high-performance computing (HPC), 5G base station infrastructure, industrial laser systems, power electronics, RF amplifiers, and medical imaging equipment — any application where reliable thermal management under high heat loads is critical.